Simulation of The Temperature Profile of The Curing Process of Thick Carbon Fiber Laminates Using The Age Algorithm
DOI:
https://doi.org/10.51903/elkom.v13i1.11Keywords:
programming, problems, material, systemAbstract
This paper determines by simulation the temperature profiles of a thick carbon fiber/epoxy laminate during its cure process. The one-dimensional model of heat transfer is solved by using a finite difference numerical scheme. In the process, the same physical and thermal properties of materials used by ZhanSheng et al. are employed. The temperature is calculated through a judicious formulation and application of the Alternating Group Explicit (AGE) iterative method developed by Evans and Sahimi. A fourthorder Runge Kutta method is applied for the cure. The AGE scheme proves to be a viable iterative method with respect to stability, efficiency and rate of convergence.
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